Moisture Barrier Bags
High humidity is known to cause problems with electronic parts and
components, however compliance with RoHS standards has raised awareness
of moisture issues and seen a huge increase in the use of moisture
barrier bags.
Use of unleaded solder in the manufacturing process requires much higher temperatures and therefore increased humidity levels, this means that manufacturers are having to provide better preventative measures, not only enclosing the parts in moisture barrier material but also allowing the removal of moisture laden air (vac packing). Labels and artwork on these barrier bags indicate the special nature of its contents as well as the age and rebaking procedures.
Use of unleaded solder in the manufacturing process requires much higher temperatures and therefore increased humidity levels, this means that manufacturers are having to provide better preventative measures, not only enclosing the parts in moisture barrier material but also allowing the removal of moisture laden air (vac packing). Labels and artwork on these barrier bags indicate the special nature of its contents as well as the age and rebaking procedures.
