Sections In Wafer Processing
Wafer dicing tape is used in the process of singulating a wafer into an individual die. The dicing tape is adhered to the wafer frame and wafer in ord...
Wafer backgrinding tape is used in the backgrinding or thinning process that achieves the necessary wafer thickness prior to dicing and assembly. The ...
With products suitable in a range from standard uses to precision engineered applications, carrier tape is the industry standard in component packagin...
Acupaq’s innovative wafer shippers are used by key semiconductor companies and are used to protect your wafers during both internal and external trans...
High humidity is known to cause problems with electronic parts and components, however compliance with RoHS standards has raised awareness of moisture...
Metallised anti static / static shield bags are designed for storage and shipment of electrostatic sensitive semi-conductor components and assemblies....
Humidity Indicating Cards (HIC) are a low cost method of indicating humidity conditions in vacuum sealed moisture barrier bags containing packaged dev...
