Wafer Processing

Acupaq offer wafer processing solutions to assist in the protection and securing of a wafer during the backgrinding and dicing process. These products are available in various thicknesses, material types (including expandable films), and adhesive types (both UV and non-UV). All our wafer films are produced utilising Total Thickness Variation Control (TTV) to ensure repeatability and consistency throughout a roll. This eliminates issues such as chipping during the wafer dicing process or mis-picks post dicing.

Acupaq also offer SFT™ (Sharp Form Tape) carrier tape for precision applications, which can be processed in a clean-room environment.