Acupaq introduce new semi automatic splice tool

News: Semi Automatic Splice Tool

Acupaq has announced the addition of a new semi automatic splice tool to the existing range of splice tapes and tools.

As opposed to conventional hand tools, which hold individual shims, the new stapler design tool takes a bandolier type shim and with 20 shims per sheet, there is an immediate increase in production line productivity. The tool also provides a more cost effective solution over the conventional tool by not only reducing labour time but also reducing the amount of wastage caused by easily damaged individual shims.

The tool can be used with all types of SMT material and may be installed easily onto a docking station. Of steel construction the tool is durable and hardwearing, and comes with an ergonomically designed handle for additional operator comfort.

For more information please call us on 0141 950 6643.

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Peel Packaging for IC’s Provide Multiple Benefits

Peel Packaging for IC's

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An innovative and ‘unique’ peel packaging solution for integrated circuits (ICs) designed to benefit its customers worldwide has been announced by Farnell.

Peel packaging offers complete protection to each individual component in transit, storage and handling by placing them within a protective, recyclable and biodegradable plastic cell which is then sealed with an anti-static lid.

The new packaging is offered at no extra charge and gives a host of other important benefits including: clear product identification with batch number, Farnell part number and manufacturer part code, reduced risk of moisture ingress and easy quantity counting.

Peel packaging has been developed by Farnell in conjunction with Antistat (Acupaq’s sister company) – a specialist in providing supply chain and packaging solutions to the electronics, medical and automotive markets. Initially, over 800 of Farnell’s most popular ICs are being offered with the packaging as standard. Peter Davies, director of product development, said: “The closeness of Farnell’s relationship with the design engineering community enabled us to recognise a real need in the market for the improved packaging of ICs. Peel packaging is truly innovative and not only provides more effective protection against static and physical damage, but also aids storage and quantity counting and a lot more besides.”