Peel Packaging for IC’s Provide Multiple Benefits

Peel Packaging for IC's

Courtesy of

An innovative and ‘unique’ peel packaging solution for integrated circuits (ICs) designed to benefit its customers worldwide has been announced by Farnell.

Peel packaging offers complete protection to each individual component in transit, storage and handling by placing them within a protective, recyclable and biodegradable plastic cell which is then sealed with an anti-static lid.

The new packaging is offered at no extra charge and gives a host of other important benefits including: clear product identification with batch number, Farnell part number and manufacturer part code, reduced risk of moisture ingress and easy quantity counting.

Peel packaging has been developed by Farnell in conjunction with Antistat (Acupaq’s sister company) – a specialist in providing supply chain and packaging solutions to the electronics, medical and automotive markets. Initially, over 800 of Farnell’s most popular ICs are being offered with the packaging as standard. Peter Davies, director of product development, said: “The closeness of Farnell’s relationship with the design engineering community enabled us to recognise a real need in the market for the improved packaging of ICs. Peel packaging is truly innovative and not only provides more effective protection against static and physical damage, but also aids storage and quantity counting and a lot more besides.”