Wafer Processing

Backgrinding Tape

Wafer backgrinding tape is used in the backgrinding or thinning process that achieves the necessary wafer thickness prior to dicing and assembly. The backgrounding tape is adhered to the wafer and offers protection from mechanical damage and contamination during the backgrinding process.

Backgrinding Process

Seen in 'traditional' semiconductor applications and is becoming more common in thin wafer and MEMS applications. Acupaq distributes backgrinding tapes with UV and non-UV adhesives and is available from over 30 stocking locations worldwide.

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