Jedec / Waffle Trays
JEDEC trays, also known as a waffle tray or IC tray are supplied by Acupaq in globally recognised matrices to support component packaging needs meeting EIA, JEDEC and EIAJ standard. All IC’s are supported, and can be supplied to meet high volume component manufacture or low volume production packaging needs.
IC Packaging
We hold extensive stocks from a wide range of manufacturers, most of the waffle trays are to JEDEC standard, however it is worth noting that some may be manufacturer specific. If you require heat resistant trays this must be specified at the point of order.
Trays currently available:
| BGA |
FBGA |
MQFP |
SSOP |
| CABGA |
FCBGA |
PBGA |
SVFP |
| CBGA |
FQFP |
QFN |
TBGA |
| CFP |
LCC |
PGA |
TQFP |
| CQFP |
LFBGA |
PLCC |
TSOP |
| CSP |
LFP |
PQFP |
TSOPII |
| DSBGA |
LQFP |
QFP |
VFBGA |
| EPBGA |
MLF |
SOIC |
|
Thermoform IC Trays
Acupaq also offer a thermoformed alternative to the JEDEC tray that offers the same functionality with a tray that is 1/3 of the weight and ½ the price of existing trays. This package was developed to deliver a lighter, cheaper tray that will aid your company in reducing it’s carbon footprint in many ways. This innovative alternative has been developed by our sister company Cyberpac, with whom we are working to develop new methods of component packaging.
Acupaq manufactures and distributes JEDEC trays from its global manufacturing and stocking locations.
