Dicing Tape ProFilm DX266C

Wafer Dicing Tape

ProFilm™ DX266C, a protective surface film, is designed to ensure consistent, precise and repeatable wafer production yields. Enhanced by superior coating technology, ProFilm™ DX266C delivers Total Thickness Variation (TTV) control, expandable base film and a special low-extractable release liner to significantly reduce silicon residue.

• Thick film, excellent for substrate dicing
• Specially formulated PVC film for unparalleled protection
• Coated with stable bond pressure sensitive adhesive
• Results in consistent release of sawn die
• Film is transparent and untinted to help human and electronic vision die defect recognition

Construction
ProFilm™ DX266C is constructed in three layers:

• Polyvinyl Chloride Base Film (10.0Mils)
• Pressure Sensitive Adhesive (0.5Mils)
• Release Film (0.92Mils)

Configurations
ProFilm™ DX266C is available in a variety of configurations. Standard widths include 200mm, 230mm, 250mm, 275mm, 300mm, 330mm and 400mm. Rolls are 100mm in length, splice-free, and wound on a 3” I.D. plastic core. Both custom widths and lengths may be available by special request. ProFilm™ DX266C rolls are polybag wrapped and individually boxed.

Shelf Life and Storage
ProFilm™ DX266C should be stored in a climate controlled environment where conditions do not exceed 25°C (75°F). If stored as recommended, the product will yield a shelf life of 6 months from the date of manufacture found on the

ProFilm DX266C Material Properties
1 Bond Test on Stainless Steel Wafer at 180° peel angle and 300mm/min peel and stretching speed. The values presented for this product are typical laboratory data and may be changed without notice.