Dicing Tape ProFilm DX266C

Wafer Dicing Tape

ProFilm™ DX266C, a protective surface film, is designed to ensure consistent, precise and repeatable wafer production yields. Enhanced by superior coating technology, ProFilm™ DX266C delivers Total Thickness Variation (TTV) control, expandable base film and a special low-extractable release liner to significantly reduce silicon residue.

  • Thick film, excellent for substrate dicing
  • Specially formulated PVC film for unparalleled protection
  • Coated with stable bond pressure sensitive adhesive
  • Results in consistent release of sawn die
  • Film is transparent and untinted to help human and electronic vision die defect recognition

ProFilm™ DX266C is constructed in three layers:

  • Polyvinyl Chloride Base Film (10.0Mils)
  • Pressure Sensitive Adhesive (0.5Mils)
  • Release Film (0.92Mils)

ProFilm™ DX266C is available in a variety of configurations. Standard widths include 200mm, 230mm, 250mm, 275mm, 300mm, 330mm and 400mm. Rolls are 100mm in length, splice-free, and wound on a 3” I.D. plastic core. Both custom widths and lengths may be available by special request. ProFilm™ DX266C rolls are polybag wrapped and individually boxed.

Shelf Life and Storage
ProFilm™ DX266C should be stored in a climate controlled environment where conditions do not exceed 25°C (75°F). If stored as recommended, the product will yield a shelf life of 6 months from the date of manufacture found on the

ProFilm DX266C Material Properties
1 Bond Test on Stainless Steel Wafer at 180° peel angle and 300mm/min peel and stretching speed. The values presented for this product are typical laboratory data and may be changed without notice.

Property Typical Value Test Method / Standard
Adhesive Strength 525g/25mm ASM D 1000
Tensile Strength 24 N/mm MD
20 N/mm TD
ASTM D 882
Elongation >400% MD
>400% TD
ASTM D 882
Thickness w/o Release Liner 267μ (10.5 mils) ASTM D 1005
Temperature Resistance >5 min. @ 50-55°C
Download PDF spec sheet of this product here

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